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1

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules

Daniel T. Rooney, Louis Gullo, Dongji Xie, N. Todd Castello, Dongkai Shangguan

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.33 MB

english, 2007

2

“Favoring my playmate seems fair”: Inhibitory control and theory of mind in preschoolers’ self-disadvantaging behaviors

Xie, Dongjie, Pei, Meng, Su, Yanjie

Journal:

Journal of Experimental Child Psychology

Year:

2019

File:

PDF, 555 KB

2019

3

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie, Janne Sundelin, Toivo Lepistö, Eero Ristolainen

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.90 MB

english, 2004

4

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Crack monitoring and life modeling technique towards high thermal cyclic and mechanical reliability of fcBGA solder joint

Xie, Dongji, Wu, Zhongming, Woo, Min, McMullen, Tom

Year:

2014

Language:

english

File:

PDF, 2.67 MB

english, 2014

5

[IEEE 2018 IEEE International Conference on Information Communication and Signal Processing (ICICSP) - Singapore, Singapore (2018.9.28-2018.9.30)] 2018 IEEE International Conference on Information Communication and Signal Processing (ICICSP) - Robust Adaptive Filtering under Least q-Gaussian Kernel Mean p-Power Error Criterion

Li, Xifeng, Peng, Libiao, Bi, Dongjie, Xie, Yongle

Year:

2018

Language:

english

File:

PDF, 514 KB

english, 2018

6

“Favoring my playmate seems fair”: Inhibitory control and theory of mind in preschoolers’ self-disadvantaging behaviors

Xie, Dongjie, Pei, Meng, Su, Yanjie

Journal:

Journal of Experimental Child Psychology

Year:

2019

Language:

english

File:

PDF, 555 KB

english, 2019

7

Multifrequency Compressed Sensing for 2-D Near-Field Synthetic Aperture Radar Image Reconstruction

Bi, Dongjie, Xie, Yongle, Ma, Lan, Li, Xifeng, Yang, Xiahan, Zheng, Yahong Rosa

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

2017

Language:

english

File:

PDF, 2.31 MB

english, 2017

8

Reliability studies and design improvement of mirror image CSP assembly

Dongji Xie, Sammy Yi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 474 KB

english, 2002

9

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Failure strength study of silicon die and LCD glass by FEA and experiment

Billy Hu,, Charles Cai,, Dongji Xie,, Boyi Wu,

Year:

2010

Language:

english

File:

PDF, 629 KB

english, 2010

10

Au(I)-Catalyzted Synthesis of 5-Bromodifluoromethyl Pyrazoles from Fluorinated Alkynyl Ketones and Hydrazine

Shan Li, Zhengke Li, Dongjie Peng, Yajun Li, Jiangtao Zhu, Haibo Xie, Yafen Yuan, Zixian Chen, Yongming Wu

Journal:

Chinese Journal of Chemistry

Year:

2011

Language:

english

File:

PDF, 87 KB

english, 2011

11

Materials characterization of the effect of mechanical bending on area array package interconnects

Daniel T Rooney, N Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 1.00 MB

english, 2004

12

A Sparsity Basis Selection Method for Compressed Sensing

Bi, Dongjie, Xie, Yongle, Li, Xifeng, Zheng, Yahong Rosa

Journal:

IEEE Signal Processing Letters

Year:

2015

Language:

english

File:

PDF, 922 KB

english, 2015

13

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Solder Joint Reliability of Double-Side Mounted DDR Modules for Consumer and Automotive Applications

Xie, Dongji, Hai, Joe, Wu, Zhongming, Economou, Manthos

Year:

2019

File:

PDF, 823 KB

2019

14

Microwave-mediated fabrication of silver nanoparticles incorporated lignin-based composites with enhanced antibacterial activity via electrostatic capture effect

Wang, Yalin, Li, Zhixian, Yang, Dongjie, Qiu, Xueqing, Xie, Yuanxiang, Zhang, Xing

Journal:

Journal of Colloid and Interface Science

Year:

2021

File:

PDF, 3.26 MB

2021

15

A Robust Hybrid Filtering Method for Accurate Battery Remaining Useful Life Prediction

Li, Xifeng, Peng, Libiao, Gao, Le, Bi, Dongjie, Xie, Xuan, Xie, Yongle

Journal:

Year:

2019

Language:

english

File:

PDF, 55 KB

english, 2019

16

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Xie, Dongji, Geiger, David, Shangguan, Dongkai, Rooney, Daniel T., Gullo, Louis J.

Year:

2005

Language:

english

File:

PDF, 989 KB

english, 2005

17

Association between admission lactate levels and mortality in patients with acute coronary syndrome

Liang, Dongjie, Zhou, Xiaodong, Hong, Xia, Feng, Xiafei, Shan, Peiren, Xie, Qiangli, Xu, Tiancheng, Cai, Mengxing, Zhou, Jian, Wang, Songjie, Huang, Weijian

Journal:

Coronary Artery Disease

Year:

2019

Language:

english

File:

PDF, 171 KB

english, 2019

18

The developmental difference of inattentional blindness in 3-to-5-year-old preschoolers and its relationship with fluid intelligence

Zhang, Hui, He, Chunli, Yan, Congcong, Zhao, Dingwei, Xie, Dongjie

Journal:

Consciousness and Cognition

Year:

2019

Language:

english

File:

PDF, 321 KB

english, 2019

19

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Solder joint behavior of area array packages in board level drop for handheld devices

Dongji Xie,, Arra, M., Sanuny Yi,, Rooney, D.

Year:

2003

Language:

english

File:

PDF, 542 KB

english, 2003

20

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Duplicable and effective — A new drop test for BGA assemblies

Xie, Dongji, Zhang, Andy, Shirangi, Hossein, Schwandt, Sheldon, Roggeman, Brian

Year:

2015

Language:

english

File:

PDF, 2.94 MB

english, 2015

21

Rh-catalyzed intramolecular sp2 C–H bond difluoromethylenation

Li, Yajun, Zhu, Jiangtao, Xie, Haibo, Li, Shan, Peng, Dongjie, Li, Zhengke, Wu, Yongming, Gong, Yuefa

Journal:

Chemical Communications

Year:

2012

Language:

english

File:

PDF, 656 KB

english, 2012

22

Analog Circuits Soft Fault Diagnosis Using Rényi’s Entropy

Xie, Xuan, Li, Xifeng, Bi, Dongjie, Zhou, Qizhong, Xie, Sanshan, Xie, Yongle

Journal:

Journal of Electronic Testing

Year:

2015

Language:

english

File:

PDF, 749 KB

english, 2015

23

[IEEE 2014 IEEE 17th International Conference on Computational Science and Engineering (CSE) - Chengdu, China (2014.12.19-2014.12.21)] 2014 IEEE 17th International Conference on Computational Science and Engineering - Rényi's Entropy Based Method for Analog Circuits Soft Fault Detection

Xie, Xuan, Li, Xifeng, Bi, Dongjie, Zhou, Qizhong, Xie, Yongle, Xie, Sanshan

Year:

2014

Language:

english

File:

PDF, 515 KB

english, 2014

24

miR-487a promotes progression of gastric cancer by targeting TIA1

Yang, Xuefeng, Wang, Mingda, Lin, Bohao, Yao, Dongjie, Li, Jin, Tang, Xianchun, Li, Sanhua, Liu, Yun, Xie, Rui, Yu, Shouyang

Journal:

Year:

2018

Language:

english

File:

PDF, 2.66 MB

english, 2018

25

Risk Factors for Reoperation After Debridement of Acute Pancreatitis

Zhifeng, Zhao, Rongli, Xie, Li, Li, Jun, Zhang, Dongjie, Shen, Zhiwei, Xu, Enqiang, Mao, Jian, Fei

Journal:

Journal of Surgical Research

Year:

2020

File:

PDF, 252 KB

2020

26

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A new method to evaluate BGA pad cratering in lead-free soldering

Dongji Xie,, Chin, Clavius, KarHwee Ang,, Lau, Dennis, Dongkai Shangguan,

Year:

2008

Language:

english

File:

PDF, 1.20 MB

english, 2008

27

A Splitting Bregman-Based Compressed Sensing Approach for Radial UTE MRI

Bi, Dongjie, Ma, Lan, Xie, Xuan, Xie, Yongle, Li, Xifeng, Zheng, Yahong Rosa

Journal:

IEEE Transactions on Appiled Superconductivity

Year:

2016

Language:

english

File:

PDF, 879 KB

english, 2016

28

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board

Lall, Pradeep, Dornala, Kalyan, Zhang, Di, Xie, Dongji, Zhang, Andy

Year:

2014

Language:

english

File:

PDF, 4.81 MB

english, 2014

29

High nonlinear coefficient SnO2 varistors tailored by Mn2O3 doping

Liu, Dongji, Wang, Weiqing, Wang, Feng, Cheng, Kuan, Xie, Qingyun, Zhou, Yuanxiang, Zhao, Hongfeng

Journal:

Materials Science in Semiconductor Processing

Year:

2020

File:

PDF, 1.12 MB

2020

30

Characterization of Antigenic Relatedness Among GI Norovirus Genotypes Using Serum Samples From Norovirus-Infected Patients and Mouse Sera

Xie, Dongjie, Chen, Junrui, Yu, Jingrong, Pei, Fuyu, Koroma, Mark Momoh, Wang, Lu, Qiu, Mengsi, Hou, Yuzhen, Yu, Dexian, Zhang, Xu-Fu, Dai, Ying-Chun

Journal:

Frontiers in Microbiology

Year:

2020

File:

PDF, 4.52 MB

2020

31

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Impact Performance of Microvia and Buildup Layer Materials and Its Contribution to Drop Test Failures

Xie, Dongji, Wang, Jonathan, Yu, Him, Lau, Dennis, Shangguan, Dongkai

Year:

2007

Language:

english

File:

PDF, 3.25 MB

english, 2007

32

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Yield Study of Inline Package on Package (PoP) Assembly

Xie, Dongji, Geiger, David, Shangguan, Dongkai, Hu, Billy, Sjoberg, Jonas

Year:

2008

Language:

english

File:

PDF, 6.21 MB

english, 2008

33

Robust Adaptive Filtering With q-Gaussian Kernel Mean p-Power Error

Peng, Libiao, Li, Xifeng, Bi, Dongjie, Xie, Yongle

Journal:

IEEE Signal Processing Letters

Year:

2018

Language:

english

File:

PDF, 669 KB

english, 2018

34

Measurement Uncertainty Estimation for Electromagnetism Devices and Equipment Using Extreme Fisher Information

Xie, Xuan, Li, Xifeng, Bi, Dongjie, Zhou, Qizhong, Xie, Sanshan, Xie, Yongle

Journal:

IEEE Transactions on Appiled Superconductivity

Year:

2016

Language:

english

File:

PDF, 352 KB

english, 2016

35

Molecular characterization of the Sex-lethal gene in mud crab Scylla paramamosain and its potential role in sexual development

Wang, Mengen, Xie, Xi, Xu, Dongjie, Wang, Zhenya, Yu, Guohong, Jin, Zhongwen, Zhu, Dongfa

Journal:

Comparative Biochemistry and Physiology Part B: Biochemistry and Molecular Biology

Year:

2020

File:

PDF, 726 KB

2020

36

Multiple Î¼-Stable Synchronization Control for Coupled Memristive Neural Networks With Unbounded Time Delays

Peng, Libiao, Li, Xifeng, Bi, Dongjie, Xie, Xuan, Xie, Yongle

Journal:

IEEE Transactions on Systems, Man, and Cybernetics: Systems

Year:

2020

File:

PDF, 1.91 MB

2020

37

Superhydrophobic Shape Memory Polymer Microarrays with Switchable Directional/Antidirectional Droplet Sliding and Optical Performance

Wang, Wu, Lai, Hua, Cheng, Zhongjun, Fan, Zhimin, Zhang, Dongjie, Wang, Jingfeng, Yu, Songji, Xie, Zhimin, Liu, Yuyan

Journal:

ACS Applied Materials & Interfaces

Year:

2020

File:

PDF, 3.51 MB

2020

38

Materials characterization of the effect of mechanical bending on area array package interconnects

Rooney, Daniel T., Todd Castello, N., Cibulsky, Mike, Abbott, Doug, Xie, Dongji

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 579 KB

english, 2003

39

[IEEE 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC ) - Houston, TX, USA (2018.5.14-2018.5.17)] 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) - Near-field millimeter-wave imaging using a fast matrix-free sparse Bayesian learning approach

Pan, Long, Bi, Dongjie, Li, Xifeng, Xie, Xuan, Xie, Yongle

Year:

2018

Language:

english

File:

PDF, 1.59 MB

english, 2018

40

Microgrid system energy storage capacity optimization considering multiple time scale uncertainty coupling

Xie, Peng, Cai, Zexiang, Liu, Ping, Li, Xiaohua, Zhang, Yongjun, Xu, Dongjie

Journal:

IEEE Transactions on Smart Grid

Year:

2018

Language:

english

File:

PDF, 831 KB

english, 2018

41

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Failure mechanism and mitigation of PCB pad cratering

Xie, Dongji, Geiger, David, Shangguan, Dongkai, Cai, Charles, Wu, Boyi, Hu, Billy, Liu, Hans, Martin, Ivan

Year:

2010

Language:

english

File:

PDF, 1.25 MB

english, 2010

42

[IEEE 2020 IEEE 3rd International Conference on Information Communication and Signal Processing (ICICSP) - Shanghai, China (2020.9.12-2020.9.15)] 2020 IEEE 3rd International Conference on Information Communication and Signal Processing (ICICSP) - Robust Compressed Sensing based on Correntropy and Smoothly Clipped Absolute Deviation Penalty

Gao, Le, Li, Xifeng, Bi, Dongjie, Xie, Xuan, Xie, Yongle

Year:

2020

File:

PDF, 3.55 MB

2020

43

ChemInform Abstract: Au(I)-Catalyzed Synthesis of 5-Bromodifluoromethyl Pyrazoles from Fluorinated Alkynyl Ketones and Hydrazine.

Shan Li, Zhengke Li, Dongjie Peng, Yajun Li, Jiangtao Zhu, Haibo Xie, Yafen Yuan, Zixian Chen, Yongming Wu

Journal:

Year:

2012

File:

PDF, 29 KB

2012

44

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - A new drop test vehicle for a uniform shock response

Xie, Dongji, Geiger, David, Shangguan, Dongkai, Hu, Billy, Werner, Bill

Year:

2010

Language:

english

File:

PDF, 926 KB

english, 2010

45

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - A Comparative Study on Drop Test Performance of Fine Pitch BGA Assemblies Using Pb-free and Tin-lead Solders

Dongji Xie,, Rooney, D.T., Geiger, D., Dongkai Shangguan,

Year:

2006

Language:

english

File:

PDF, 814 KB

english, 2006

46

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Performance of lead-free solder joints under dynamic mechanical loading

Arra, M., DongJi Xie,, Dongkai Shangguan,

Year:

2002

Language:

english

File:

PDF, 616 KB

english, 2002

47

A compressive hybrid conjugate gradient image recovery approach for radial MRI

Yuan, Taiwen, Bi, Dongjie, Pan, Long, Xie, Yongle, Lyu, Jue

Journal:

Imaging Science Journal The

Year:

2018

Language:

english

File:

PDF, 2.22 MB

english, 2018

48

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Road Test and Reliability Analysis of Automotive Electronic Modules

Xie, Dongji, Hai, Joe, Wu, Zhongming, Huang, Jack, Economou, Manthos

Year:

2017

Language:

english

File:

PDF, 842 KB

english, 2017

49

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Reliability Enhancement of Automotive Electronic Modules Using Various Glues

Xie, Dongji, Wu, Zhongming, Hai, Joe, Economou, Manthos

Year:

2018

Language:

english

File:

PDF, 397 KB

english, 2018

50

Robust Sparse Recovery in Impulsive Noise via M-Estimator and Non-Convex Regularization

Gao, Le, Bi, Dongjie, Li, Xifeng, Peng, Libiao, Xu, Weijie, Xie, Yongle

Journal:

Year:

2019

Language:

english

File:

PDF, 7.85 MB

english, 2019

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